Sisma BSP PICO Laser Marking and Engraving Machine

Laser engraving machine BSP PICO – laser marking and engraving machine Picosecond laser source (PICO) The picosecond laser generates pulses lasting just a few picoseconds, with such high intensity that nonlinear/multiphoton absorption occurs. This allows the marking process to be characterized by minimal thermal effects, allowing for precise, smooth, and clean markings without the need for additional detail processing. Compact system The BSP PICO features a robust and compact design, including a granite worktable that provides excellent process stability for workpieces weighing up to 20 kg. The base design includes three motorized axes with a 50 µm precision, a 300 x 300 mm plane stroke, and a 360 mm Z-axis travel range. Advanced software The software, fully developed by SISMA, enables file management and the entire marking process, even for the most complex tasks. It allows you to fully utilize the potential of the PICO UAV, guaranteeing a high degree of customization and accelerating and simplifying the operator's work. Technical data: Laser source: Yb – 50 W – 1030 Nm, Operating frequency: 50 – 2000 kHz, Pulse duration: 0.001 – 0.003 ns, Peak power: 10,000 kW, Pulse energy: 0.025 mJ, Beam quality: < 1.4, Galvo head: Digital, water-cooled, Maximum head positioning error: ± 8 µm, Cooling system: Built-in liquid cooling system, Axis travel (XYZ): 300 × 300 × 360 mm, Axis repeatability: 25 µm, Power supply: 230 V ± 15% 50/60 Hz, 1 phase – CEE 16A socket, Power consumption: 1 kW, Dimensions (L × D × H): 823 × 1329 × 1904 mm, Weight: 590 kg.